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Professor Kurfess will discuss how Big Data and cyber-physical systems can be used to fully move manufacturing into a digital domain using digital models, in combination with readily available High Performance Computing (HPC) platforms (e.g. multi-core , GPU and cloud). ), low-cost deployable sensing and high-bandwidth connectivity to enable rapid process and production planning for use in both cost estimating/quoting and, ultimately, production and verification. For cloud manufacturing, this will enable even the smallest and least advanced cloud manufacturing node to quickly respond to a large number of RFPs for complex parts, leveraging low-cost cyber infrastructure resources that are currently available and expanding daily.
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